Non-destructive measurement method
Transparent substrate can be measured
High-speed measurement: measure more than 1000 points per minute
High resolution: can be measured in a small square area of 5.5 * 5.5μm ~ 0.5 * 0.5 mm
High accuracy: can detect ultra-thin film thickness below 1nm
High reproducibility: Film thickness: 0.1 nm, refractive index: 0.001
Multi-zoom function: It can be measured from the whole wafer to the partial measurement, and the measurement area can be freely specified according to the customer
Powerful analysis tools: graphs of film thickness distribution at any two points, calculation of film thickness average and standard deviation in any area

Non-destructive measurement method
Measuring speed: less than 0.05 s / point
Resolution: Can be measured in a tiny square area of 1.0 * 1.0 mm
High accuracy: can detect ultra-thin film thickness below 1nm
High reproducibility: Film thickness: 0.1 nm, refractive index: 0.001
Simple operation: no driving part, can reduce the trouble of calibration
Modular application: The head module is detachable and can be used in other systems