Transparent workpiece / non-transparent workpiece
Non-destructive measurement method
Transparent substrate can be measured
High-speed measurement: measure more than 1000 points per minute
High resolution: can be measured in a small square area of 5.5 * 5.5μm ~ 0.5 * 0.5 mm
High accuracy: can detect ultra-thin film thickness below 1nm
High reproducibility: Film thickness: 0.1 nm, refractive index: 0.001
Multi-zoom function: It can be measured from the whole wafer to the partial measurement, and the measurement area can be freely specified according to the customer
Powerful analysis tools: graphs of film thickness distribution at any two points, calculation of film thickness average and standard deviation in any area
Measurement method: PCA
Reproducibility: Film thickness 0.1nm
Light source: Semiconductor laser 636nm Measurement point (square)
Wide-area mode: 0.55mm
Medium-range mode: 55μm
High resolution mode: 5.5μm
Angle of incidence: Standard 70-degree
Table size: 8 "(Expandable to 12")
Measurement speed (high resolution mode): up to 20,000 points / minute
Size: 1740 * 650 * 650mm
Weight: 120Kg
Accessories: PC